OEMs can now add the parallel processing power of the AMD Radeon 6310 GPU to their applications. Common to all the performance levels of the new boards and modules based on the AMD Embedded G-Series platform are their discrete-level graphics embedded computer capabilities. Providing support for the latest DirectXR 11 API, they enhance all conventional graphics-intensive small-form-factor embedded computer applications.
The initial goal in creating the Raspberry Pi credit card sized, Linux-based Single Board Computer (SBC) – targeted primarily at education – was to develop a response to the decline of students engaging with computer science and related engineering disciplines. Our desire was to reverse the trend of children becoming consumers rather than creators. The following case study follows the hardware development process from an early failure, initial prototypes, and through to the finished production design.
Over recent years there has been an increasing trend for children to be consumers of digital content rather than be future creators or engineers. This trend is driven by manufacturers looking to provide a seamless experience for target customers on a variety of electronic platforms, from gaming consoles to tablets and laptop computers. As a result, access to raw I/O has become restricted. Similarly, any packaged provision of a programming environment is an anathema to the products’ commercial goals. ........
A new starter kit for COM Express(tm) modules with AMD Embedded R-Series Accelerated Processing Unit (APU) is now available. The intelligent starter kit MSC C6-SK-A7-T6T2 contains a COM Express(tm) Type 6 baseboard, an active heat sink with fan and two DDR3 memory modules.
The intelligent starter kit MSC C6-SK-A7-T6T2 contains a COM Express™ Type 6 baseboard, an active heat sink with fan and two DDR3 memory modules. Users of the kit are free to choose one of four COM Express™ Type 6 computer modules with Embedded R-Series APU from MSC’s MSC C6C-A7 product family. Furthermore, the starter kit is also offered with a 15 inch XGA TFT display with LED backlight. Different display types or touch screen panels are available on request.
The compact baseboard with dimensions of 140 mm x 184 mm offers the module socket and numerous important connectors, above all the newly available Type 6 interfaces defined in the COM Express™ specification V2.0. The interfaces include configurable Digital Display Interfaces (DDI) which can be used via three each DisplayPort and HDMI connectors and a DVI port. In addition, four USB 3.0 ports, Ethernet, VGA, HD audio, SATA and even a PCI Express™ x4 slot also found place onboardThe COM Express™ Type 6 module platform MSC C6C-A7 from MSC integrates an Embedded R-Series APU from AMD and is characterized by very powerful graphics and high parallel computing performance with low power dissipation. Today, there are four processor variants available. For power demanding applications, the MSC C6C-A7 computer-on-modules integrate an AMD R-460L 2.0 GHz (2.8 GHz Turbo) or AMD R-452L 1.6 GHz (2.4 GHz Turbo) quad-core processors. The thermal design power (TDP) levels are 25 W and 19 W, respectively. The two dual-core versions are populated with the AMD R-260H 2.1 GHz (2.6 GHz Turbo) processor or the AMD R-252F 1.7 GHz (2.3 GHz Turbo) processor – each featuring 17 W TDP. The processors support the AMD64 technology and the AMD-V™ virtualizatiotechnology..................
ANR-IB75N1/A/B is a rackmount platform (440x372x44mm) which can be installed in the 19” rack. It can carry a 3rd generation Intel Core i i3, i5, i7, or Pentium processors to deliver higher efficiency, increased processing throughput, and improved performance on applications. ANR-IB75N1/A/B also comes equipped with a maximum 16GB DDR3 memory and optional 2 or 4 x SFP and 8 x LAN ports. System Integrators can select different configurations for their network appliances. It offers the best P/P ratio in applications like the UTM, IDS/IPS, VPN, Firewall, Anti-Virus, Anti-Spam, RSA gateway, QoS, streaming.
ANR-IB75N1/A/B uses 80 Plus PSU which reduces energy consumption and helps protect the environment. The software and hardware configurable LAN bypass feature also prevents communication breaks due to power loss or system hang-ups. In addition to Intel long life support chipsets, ANR-IB75N1/A/B is designed with a long-term support of 5 years.
Key features: 1. Support 3rd generation Intel Core i LGA1155 i3/i5/i7/Pentium cores processor 2. Intel B75 Chipset 3. DDRIII DIMM x 2, up to 16GB memory. 4. Intel 82576EB x 2 Fiber ports 5. Intel 82574L 10/100/1000Mbps x 8 ports 6. Two pairs LAN ports support bypass feature (LAN 1/2 + LAN 3/4) 7. LAN bypass can be controlled by BIOS and Jumper 8. CF socket, 2.5” HDD x 2, SATA III x 1, SATA II X1 9. Console, VGA (pinhead), USB 3.0 x 2 (2 x external) 10. Support boot from LAN, console redirection 11. Equipped with 80 Plus Bronze PSU to decrease CO2 dissipation and protect our environment 12. LCM module to provide user-friendly interface 13. Standard 1U rackmount size
Ordering information： 1.ANR-IB75N1: 1U Networking Rackmount Platform with PCH B75, 8 x RJ45 GbE LAN (2 pair bypass)
2.ANR-IB75N1A: 1U Networking Rackmount Platform with PCH B75, 8 x RJ45 GbE LAN (2 pair bypass), and 2 x Fiber ports
3.ANR-IB75N1B: 1U Networking Rackmount Platform with PCH B75, 8 x RJ45 GbE LAN (2 pair bypass), and 4 x Fiber ports
Contact： http://www.acrosser.com/inquiry.html
Virtualization trends in commercial computing offer benefits for cost, reliability, and security, but pose a challenge for military operators who need to visualize lossless imagery in real time. 10 GbE technology enables a standard zero client solution for viewing pixel-perfect C4ISR sensor and graphics information with near zero interactive latency.
A new All-in-OneGaming Board, the AMB-A55EG1. AMB-A55EG1 features AMD Embedded G-Series T56N 1.65GHz dual-core APU, two DDR3-1333 SO-DIMM, which provides great computing and graphic performance is suitable for casino gaming and amusement applications. It is designed to comply with the most gaming regulations including GLI, BMM, and Comma 6A. AMB-A55EG1 is specifically designed to be a cost competitive solution for the entry-level gaming market.
AMB-A55EG1 utilizes the functions of an X86 platform, 72-pin Gaming I/O interface, intrusion detection and also various security options, and a complete line of Application Programming Interfaces to create smoother gaming development.
For more information on AMB-A55EG1 or any other products, please contact your local Acrosser sales channel or logon to our website: www.acrosser.com
FPGAs have become some of the most importantdrivers for developmentof leading edge semiconductor technology. The complexity ofprogrammabledevices, and their integration of diverse high-performance functions, provides excellent vehicles
for testing new processes. It’s no accident that Intel has selected
Achronix and Tabula, both makers of programmable devices, as the only
partners that have been granted access to their 22 nm 3D Tri-Gate
(FinFET) process. In February, Intel also announced an agreement with
Altera, which will enable the company to manufacture FPGAs using their
next-generation 14 nm Tri-Gate process.
In parallel with driving manufacturing,FPGA technology development must also include enhancements to design tools and flows. As vendors strive to make their devices moreSoC- and ASIC-like, they are also adopting standards and collaborating withEDA companies to integrate their tools more seamlessly. These collaborations are producing great benefits for designers, as FPGA design methodologies are leading the way in areas that the EDA industry has long been promising new capabilities, such as in Electronic System Level (ESL) synthesis, IP integration and re-use, and higher-level tools for software/hardware co-design.
FPGA design methodologies have long integrated EDA point tools, such as simulation and PCB design, into FPGA vendor’s design platforms. Now, vendors such asSynopsys, with their Synplicity tools, and Xilinx with Vivado, are collaborating to build more complete integrated top-to-bottom flows. To address the greater complexity of FPGAs that may now contain up to two million equivalent logic cells, Synopsys has added Hierarchical Project Management(HPM) to Synplicity. HPM supports distributed design teams and parallel development, enabling partitioning ofRTLand sharing of design debug tasks. Xilinx has adopted the industry-standardSynopsys Design Constraint(SDC) timing constraints (to replace Xilinx proprietary UDC) in a design flow that can be driven from standardVerilog HDL.
1.EASING IP INTEGRATION
2.INDUSTRY STANDARDS ENABLE HIGHER LEVELS OF ABSTRACTION
Many of today's embedded systems incorporate multiple analog sensors that make devices more intelligent, and provide users with an array of information resulting in improved efficiency or added convenience. The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU, is often an assumed "burden" in designing sensor interface circuits. However, the latest concept in a configurable AFE, integrated into a single package, is helping systems designers overcome sensor integration challenges associated with tuning and sensor drift, thereby reducing time to market. The following discussion examines how the versatility of such a technology allows the designer to tune and debug AFE characteristics on the fly, automate trimming and adjust for sensor drift, and add scalability to support multiple sensor types with a single platform.
The ubiquitous use of sensors in our smart devices – from cell phones to industrial equipment and even medical devices – has increased the need for more intelligent sensor technologies that are more versatile, lower overall costs, and require fewer resources to develop and maintain.
Most analog sensor systems comprise three key elements: the analog sensor that measures a specific form of energy, the micro controller (MCU) that processes the digital equivalent of the sensor’s signal, and between them is the Analog Front End (AFE) system (Figure 1). The AFE receives the sensor’s signal and converts/transforms it for the MCU to use, as in most cases the sensor output signals cannot be directly interfaced to an MCU.
Figure 1: The Analog Front End (AFE) converts and conditions analog sensor signals for use by the MCU.
The challenge associated with current AFE design approaches is the time-consuming trial-and-error tuning process, and the lack of flexibility and scalability to support multiple sensors from a single AFE. Moreover, many AFEs do not account for sensor drift or adjust for sensor trimming during production, which directly reduces the quality of the sensor. However, new fully configurable AFE technology is enabling designers to overcome these hurdles.
The importance of the AFE
The AFE itself performs multiple functions, depending on the application. One function of the AFE is to amplify signals that are too weak for the MCU to read. The AFE circuitry employs amplifiers to provide output voltages that are hundreds or up to thousands of times larger than the voltage provided by the sensor. This is typically done with op-amps that can vary widely in cost and power based on the required characteristics. Depending on the sensor characteristics, the AFE amplifier structure will vary. For example, if the sensor output is differential and low impedance, a simple differential input can be used. If, on the other hand, the sensor output is differential and high impedance, a more complicated instrumentation amplifier, with matching high-impedance inputs, may be needed.
Another function of the AFE is to filter unwanted frequency ranges from the sensor, for example, to satisfy the Nyquist limit or to remove a DC offset. This noise must be removed before the analog signal is converted to digital. The AFE must employ low-pass filter circuitry to block out high-frequency noise and/or employ high-pass circuits to remove lower-frequency noise.
A third function of the AFE is to convert signals from one signal type to another. For example, typical sensors output a voltage, but some output a current. The MCU ADC circuits do not accept current inputs, so such currents have to be converted to voltages before going to the MCU. This current-to-voltage conversion is performed by the AFE circuit, called a transimpedance (I/V) circuit, which also amplifies the resulting voltage to levels usable by the MCU.
Challenges to AFE designs
Most AFE circuits are custom designed to meet the electrical requirements of a particular system under development. Engineers must design the circuitry, select the appropriate ICs and passive components, then test and tune the resulting circuit and PCB layout. In many cases, this takes a trial-and-error method to calibrate the right analog circuit design. This iterative tuning process is time and resource consuming, adversely affecting development cost and time-to-market. In addition, the AFE is often difficult to simulate and must be adjusted because of specific component behavior, board layout, and nearby noise sources.
There is also limited or no scalability of the AFE circuitry to support multiple sensors, let alone multiple types of sensors (that is, different topologies). The AFE circuit is designed for one particular sensor, making it difficult to swap one sensor for another using the same AFE – even if they employ the same topology.
Finally, sensors need constant tuning either during production – adjusted for sensor trimming – or because they degrade over time and cannot easily be corrected after they are deployed in the field. Fixed-component AFE designs do not correct for sensor drift nor are they easily adjusted for sensor trimming. A software-supported design approach can help.
Let’s examine each of these challenges.
Configurable AFE eases calibration trial and error
Looking at the hundreds of different types of sensors available, one can observe common topologies and signal characteristic ranges and understand that having the ability to simply change the characteristics of the op-amps, or to dynamically change the gain values, will significantly reduce the complexity and reduce development time.
The Renesas Smart Analog technology is an example of a fully configurable AFE technology that allows for such capability. As Figure 2 shows, such technology includes five elements: three separate configurable amplifiers, an additional amplifier with sync detection capability, a general-purpose op-amp, a low-pass filter with variable cutoff frequency, and lastly, a high-pass filter with variable cutoff frequency.
Figure 2: Diagram of a fully configurable AFE with an optional integrated MCU
The design engineer can create the desired custom AFE circuitry by simply setting the main parameters for these various circuit blocks, and then selecting the connections between these blocks. Three highly configurable amplifiers can be used to produce a tailored I/V transimpedance converter/amplifier, a noninverting amplifier, an inverting amplifier, a differential amplifier, or a summing amplifier. The chip can be custom configured to implement a range of signal amplification gains, and it provides an adjustable span of signal voltage offsets.
Additionally, the amplifiers in this IC can be configured to implement a single-channel, high-impedance instrumentation amplifier. This type of differential amplifier is essential for interfacing to high-impedance sensors such as piezoelectric types.
As the AFE takes care of amplifying/filtering/converting the signals from the sensor, the MCU (internal or external device) can analyze the AFE signals to dynamically change the gain values (that is, while the system is operating) to compensate for changes in ambient environment. This “closed loop,” self-adjusting AFE structure provides a more robust, intelligent sensor interface.
An integrated AFE+MCU device offers the additional benefit of automating the trimming process as it will read the signals from the AFE and compare that to the known parameters to make the necessary adjustments on the AFE, thereby cutting system production costs. In the same way, the MCU can automatically adjust the AFE gain to counteract the signal-generation deviations expected to occur over time as the sensor degrades.
Configurable AFE provides scalability
While configurability is important to reduce complexity and debugging time, another key design factor is scalability. An AFE with enough connection terminals to accommodate all the sensors typically needed eliminates the traditional requirement to have a separate AFE circuit for each sensor. Handling the entire array of sensors via one AFE helps shrink the circuit board and simultaneously decreases system component counts while reducing power consumption by as much as 20 percent. In fact, because of the simple interface of these AFEs – to just an SPI line and the ADC channels from the MCU – it is possible to connect to as many as 96 sensors using one MCU.
A software-supported design approach
Extreme configurability can come with the burden of tool complexity, so it is important to have a simple software-based design tool that can configure and customize the characteristics of the AFE for that specific application. Designers no longer need to understand the lowest level of the hardware, nor be analog experts when the AFE register values can be simply set, and the topology, gain/offset values, and characteristics can all be done in software.
Such a tool should run on a PC and provide an easy way for selecting typical sensor types, such as pressure, humidity, acceleration, impact, magnetic, and piezoelectric types – supporting multiple topologies and characteristics. The Smart Analog software provides this highly intuitive environment where designers easily set parameters, change topologies, do offset tuning, and have the ability to add filters and, of course, have access to the signal pins.
Because the tool itself already has libraries of different sensor profiles, it is easy for a systems engineer to have a starting point in their design. A graphical representation of the output signals from the AFE can be used to monitor systems with close-to-real-time feedback, which will make it very easy to make the AFE adjustments and tuning. All these features reduce complexity in development and thus reduce resource costs.
Once the configuration is set, the tool outputs a register file that can be used by the software on the MCU. The MCU stores the sensor settings in on-chip flash (nonvolatile) memory within its firmware, and when power is applied to the system, the MCU sends the stored settings to registers in the Smart Analog IC, reconfiguring that chip accordingly.
Simplifying the burden of AFE designs
The AFE is a critical, yet sometimes underappreciated component to a sensor system. The typical discrete approach of adding op-amps and filters, and trial-and-error soldering of resistors is not efficient and the cost of time in debugging and development easily outweighs the cost of adding an intelligent, MCU-based configurable AFE. But not all configurable AFEs are built the same. So, it is important to consider the flexibility and scalability of the AFE to support different types of sensors, and the intelligence to adjust “on the fly” or in the field. Simple, easy-to-use software tools can ease this process and can be used by even the non-analog experts on the team.
The speed of innovation in automotive IVI is making a lot of heads turn. No question, Linux OS and Android are the engines for change.
The open source software movement has forever transformed the mobiledevicelandscape. Consumers are able to do things today that 10 years ago were unimaginable. Just when smartphone and tablet users are comfortable using their devices in their daily lives, another industry is about to be transformed. The technology enabled by open source in this industry might be even more impressive than what we’ve just experienced in the smartphone industry.
The industry isautomotive, and already open source software has made significant inroads in how both driver and passenger interact within theautomobile. Open source stalwartsLinuxand Google are making significant contributions not only in the user/driver experience, but also insafety-criticaloperations,vehicle-to-vehicle communications, and automobile-to-cloudinteractions.
AMB-D255T1 features powerful graphic performance via VGA and HDMI
output, one DDR3 SO-DIMM socket, mSATA socket with USB signals and SIM
slot, and a +12V DC jack for easy power input. AMB-D255T1 also provides
complete I/O such as 4 x COM ports, 6 x USB2.0 ports, 1 x GbE RJ-45
port, 1 x SATA port with power connector.
AMB-N280S1 has variety I/O ports like 5 x serial ports (one is
RS-232/422/485 selectable), 4 x USB2.0, 2 x GbE RJ-45 ports, and one
Mini-PCIe expansion. It also offers 1 x SATA interface and power
connector for the customers have large storage capacity request. There
is one HDMI port and one VGA output on AMB-N280S1 can support both two
displays to maximum resolution 1920 x 1200. It also offers the 18-bit
LVDS interface for small size LCD panel.
In order to let customer experience our premium products earlier,
Acrosser provides the special price for these two boards. Please contact
with your local sales for more information.
With the touch-screen
sector now entering a new phase of innovation, the issue of applying
multitouch operation to the larger format displays found in industrial
and public use settings is becoming a key engineering concern.
Designers must examine the sensor technology options available today and
consider using new single-layer project capacitive sensing technology
to enable sophisticated human-machine interactions in large displays
destined for harsh environments.
Multitouch
sensor technology has the potential to revolutionize the way we connect
with all manner of electronics hardware, giving touch-screen-based
Graphical User Interfaces (GUIs) the ability to recognize complex
gestures using several fingers such as rotating, two-digit scrolling,
three-digit dragging, and pinch zoom, as well as allowing multiple users
to collaborate. Analyst firm Markets & Markets predicts that the
global multitouch business will reach $5.5 billion by 2016 (constituting
more than 30 percent of the totaltouch panel
market by this stage). The multitouch segment is currently exhibiting a
compound annual growth rate of more than 18 percent, with the portable
consumer sector driving the vast majority of this growth.
Moving
forward, the problem for design engineers is knowing how to bring the
multitouch capabilities that are already becoming commonplace insmartphonesand tablet PCs to other areas that could also derive benefit from them.Digital signage, Point-Of-Sale (POS),
public information, and industrial control systems could profit greatly
from this sort of functionality. However, certain obstacles are
inhibiting the adoption of multitouch in these nonconsumer sectors.
The larger format multitouch sensor options currently on the market, though acceptable for personal use such as all-in-one touch PCs, have serious shortcomings when applied to more demanding application scenarios. Both infrared and camera-based systems require an exposed bezel for housing sensor elements. This means that, in addition to increasing vulnerability to damage from external forces, the buildup of dust or dirt in the bezel recesses can hamper operational performance over time. These systems also suffer from sensor drift and need regular recalibration to rectify this.
Certain forms of projective capacitance such as self-capacitive types, which by their nature are extremelysensitivein the Z-axis, have proved to be well suited for rugged touch-screen implementations and can measure two independent touch points simultaneously. Another form of projected capacitive sensing, mutual capacitive, which measures charge/discharge across a crossover or node between adjacent cells created by an X-Y grid, tends to be less sensitive in the Z-axis and thus typically only works well with thin glass. However, mutual capacitive sensing offers the ability to detect more than two independent touch points when mated with the appropriate control electronics and software. As a result, this technology has been chosen in recent years as the principal method of bringing multitouch functionality to consumer applications.
Pros and cons of mutual capacitive sensing
The current breed of mutual capacitive touch screens usually relies on Indium Tin Oxide (ITO) as the conductive sensing medium. ITO is already widely used throughout the display industry and provides the benefit of being near-transparent.
Though ITO has been a successful choice in touch screens, it has certain limitations when applied outside the consumer arena. First of all, although conductive, ITO has a relatively high electrical resistance. This means it generally has fairly weak through-glass performance, only able to detect touch through a front overlay thicknesses of ~2 mm. Secondly, ITO is only suitable for use with smaller display formats, as the impedance builds up over the length of the conductive track. This means that sensor systems’signal integritylevels will not be acceptable once the displays involved have diagonals that are much beyond 22", unless high input power, complex tiling arrangements, or other elaborate approaches are utilized. Finally, conventional ITO-based sensors do not permit flexibility in their production, as each new sensor design or size requires a separate set of photolithographic tools to be created (see Figure 1). This calls for considerable upfront investment and can only be justified if a large enough number of units will be manufactured to cover the initial outlay, which can be anywhere from $5,000 to $30,000 depending on size and complexity.
Figure 1:A conventional ITO-based multitouch sensor comprises many different layers.
Consider the example of an interactive digital signage or low-volume, customized POS system. The display formats required for this system would probably be too large for an ITO implementation, plus the limited front glass thickness (typically 1-2 mm at most) is unlikely to be strong enough for the demanding, public-facing, high-use environments in which it would be deployed. Furthermore, in many cases, the specialized nature of an interactive digital signage or POS system means that the number of units produced might not justify the high initial outlay for tooling associated with conventional ITO constructions. As a result, hardware designers wishing to create attention-grabbing, unique-looking user interfaces could be forced to settle for generic touch-screen designs.
Engineers also face technical and economic challenges when trying to incorporate projective capacitive-based multitouch functionality into designs where either large form factors or a relatively small number of units is involved, both of which are possible scenarios in nonconsumer design projects. However, projective capacitance sensing still proves to be the best way to ensure the longevity of touch screens in demanding environments.
A new approach to projective capacitive sensing
The engineering team at Zytronic has developed a mutual capacitive sensing approach that overcomes several significant hurdles, delivering a durable projective capacitive sensing mechanism that can simultaneously support at least 10 independent touch points and be realized on display sizes above 70". This multitouch system is based on the company’s patentedProjected Capacitive Technology(PCT), where an intricate sensor matrix comprising copper capacitors 10 mm in diameter is embedded into a laminated substrate.
This substrate can be placed behind a thick protective overlay of glass or polycarbonate to protect it from various forms of potential damage. It can detect touch events through up to 6 mm of toughened glass, effectively doubling the projective overlay thickness that can be specified and thereby providing increased protection from impact, scratches, vibration, and exposure to harsh chemicals or extreme temperatures. Furthermore, this mechanism can be operated by gloved hands, making it highly suited to uncompromising industrial environments, or via a conductive stylus, allowing users to write directly onto the screen.
By utilizing the same proven, maskless plotting process used to produce self-capacitive PCT screens for more than a decade, sensor formats can be scaled up as required, without accruing nonrecurring engineering costs for photolithograph masks. This means that the volume of units does not negatively affect the commercial viability of the project employing multitouch operation, allowing small-volume business to take advantage of this functionality in the same way as it is being sported in high-volume, consumer-oriented products.
The multitouch PCT sensor works in combination with Zytronic’s ZXY200 touch controller. This deviceprocesses all touch event data being captured by the proprietary design copper array laminated to the rear of the glass sensor. Using a mutual capacitive approach means that each of the intersecting nodes created in the pattern is individually monitored by the controller running proprietary firmware, which is optimized for the use of copper and lower resistance (hundreds of Ohms/m compared to ITO’s thousands of Ohms/m), plus the resulting improvement in Z-axis sensitivity and ultra-large-size capability. Furthermore, because the copper wires are coated in a dielectric, it is possible to deposit the electrodes in a single process/layer, resulting in a simplified cross-sectional structure to the sensor (see Figure 2). This is not possible with ITO, as multiple layers need to be deposited to create the more complex diamond electrode pattern that this requires, with the X and Y electrodes being isolated from one another.
Figure 2:A single layer of copper electrodes replaces a multiple-layer ITO-based multitouch sensor.
Energy transfer is localized to the intersection where the X and Y electrodes of the multitouch PCT touch sensor cross. An image map of the energy received is then generated from the measurements, and the position of each touch point can be determined (see Figure 3). With multiple touch points being detected on the screen, true “palm rejection” functionality can be incorporated, with touch performance in no way hampered by users resting their hands, arms, or elbows on the screen. The ability to operate with gloved hands makes it particularly appropriate for use in outdoor environments such as retail and public information applications, as well as in medical and industrial deployments where users need to wear protective clothing.
Figure 3:Image mapping can be used to determine the positions of several different touch points at once.
Innovative, versatile human-interface technology
Projective capacitive multitouch technology has already seen widespread uptake in the portable consumer space, where high-volume and small form factor designs are endemic. The emergence of innovative single-layer technology is now presenting the industry with an economically viable way of implementing multitouch functionality that can be supported both on large format displays and in harsh environments. This sophisticatedhuman-machine interactioncould effectively become ubiquitous and as a result, no longer restrict complex gesture recognition or simultaneous manipulation by several different users to portable gadgets.
3.5” SBC, AMB-N280S1,
which carries Intel dual- core 1.8 GHz Atom Processor N2800. Acrosser
takes advantage of Atom Cedar Trail N2000 series processor in design,
such as low power consumption and small footprint as former Atom series.
Intel Atom Processor N2800 provides more powerful graphic performance by
less power consumption. There are one HDMI port and one VGA output on
AMB-N280S1 can support both two displays to maximum resolution 1920 x
1200.
AMB-N280S1 Features
‧ Intel Atom N2800 1.86GHz
‧ 1 x DDR3 SO-DIMM up to 4GB
‧ 1 x VGA
‧ 1 x HDMI
‧ 1 x 18-bit LVDS
‧ 4 x USB2.0
‧ 6 x COM (5 x RS-232, 1 x RS-232/485)
‧ 2 x GbE (Realtek RTL8111E)
‧ 1 x KB/MS
‧ 1 x Mini-PCIe slots
‧ 1 x SATA
‧ 8-bit GPIO
Intel Celeron Dual-Core processor family is the latest generation of
Celeron-branded budget microprocessors. The family was introduced in January
2008, and currently consists of 7 desktop and 9 mobile microprocessors. The
Celeron Dual-core family is based on Core microarchitecture, and includes all
basic Core features:
32 KB instruction and 32 KB data cache per core;
Level 2 cache shared between two cores.
Support for SSE3 and Supplemental SSE3 instructions. Improvements in Core
micro-architecture allow the CPU to execute up to one 128-bit SSE instruction
each clock cycle.
Intel 64 technology, formerly known as Extended Memory 64 Technology, or
EM64T.
Disable bit feature. When supported by operating system, this feature
prevents system infection by certain group of viruses and malicious
programs.
Desktop Celeron E3xxx processors, based on newer Wolfdale core, feature
Virtualization technology.
The AR-R6006 carrys Intel ATOM dual-core D525 processor which supports Hyper
Threading Technology and Intel 64 architecture with low power consumption.
Enhanced low-power states allow designers to further minimize overall power
consumption. They can deliver more efficient use of processor resources, higher
processing throughput and improved performance on applications.
Key features: ‧ 1U Rack Mount chassis ‧
Low power Intel ATOM D525 Dual Core processor 1.8 GHz+ ICH8M ‧ Two DDR3
SO-DIMM support up to 4GB (unbuffered and non-ECC dimm) ‧ 6 x Intel 82574L
GbE Ethernet with 2 pair LAN Bypass Function ‧ 1 x 2.5”/3.5” SATA HDD Bay, 1
x CF Type II socket ‧ 2 x USB 2.0 ports in front ‧ 1 x Mini-PCI slot, 1 x
RJ45 for Console
The AMB-QM77T1 is the newest Mini-ITX industrial mainboard from Acrosser Technology .
AMB-QM77T1 has two DDR3 SO-DIMM sockets to support up to 16GB of system memory. Onboard 24-bit dual channel LVDS interface support big size LCD panel directly made it suitable for digital signage and panel PC applications. It also features advanced technologies including four USB 3.0 and two SATA III connectivity to deliver high speed data transmission.
The Intel 3rd generation mobile processors supported by the AMB-QM77T1 features an integrated GPU, which is capable of supporting such graphical libraries as DirectX11, OpenGL4.0 and OpenCL1.1. Targeting on multimedia and gaming applications, AMB-QM77T1 brings enhanced graphics performance by supporting 3 independent displays in any combination of VGA, HDMI, LVDS and DVI output.
The key features of the AMB-QM77T1 include:
‧ Intel QM77 chipset ‧ FCPGA socket supports 3rd Generation Intel® Core(TM) i7/i5/i3 processors and Celeron ‧ 2* DDR3-1600/1333/1066 SO-DIMM up to 16GB ‧ Supports VGA/DVI-D/HDMI/LVDS displays ‧ Support 3 independent display ‧ Dual Intel PCI-E Gigabit LAN ‧ 8* USB 2.0, 4* USB 3.0, 3* COM, 3* SATA II, 2* SATA III ‧ 1* PCI-E x16, 1* Mini PCI-E, 1* CFast socket ‧ iAMT 8.0, TPM 1.2, Watchdog timer, Digital I/O Support VGA and DVI output
Many of today's embedded systems incorporate multiple analog sensors that make devices more intelligent, and provide users with an array of information resulting in improved efficiency or added convenience. The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU, is often an assumed "burden" in designing sensor interface circuits. However, the latest concept in a configurable AFE, integrated into a single package, is helping systems designers overcome sensor integration challenges associated with tuning and sensor drift, thereby reducing time to market. The following discussion examines how the versatility of such a technology allows the designer to tune and debug AFE characteristics on the fly, automate trimming and adjust for sensor drift, and add scalability to support multiple sensor types with a single platform.
