Creating the Raspberry Pi credit card sized

The initial goal in creating the Raspberry Pi credit card sized, Linux-based Single Board Computer (SBC) – targeted primarily at education – was to develop a response to the decline of students engaging with computer science and related engineering disciplines. Our desire was to reverse the trend of children becoming consumers rather than creators. The following case study follows the hardware development process from an early failure, initial prototypes, and through to the finished production design.

Over recent years there has been an increasing trend for children to be consumers of digital content rather than be future creators or engineers. This trend is driven by manufacturers looking to provide a seamless experience for target customers on a variety of electronic platforms, from gaming consoles to tablets and laptop computers.
As a result, access to raw I/O has become restricted. Similarly, any packaged provision of a programming environment is an anathema to the products’ commercial goals. 
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refer to :http://embedded-computing.com/articles/case-card-sized-sbc/

MSC presents a Starter Kit for COM Express(tm) Type 6 Modules

A new starter kit for COM Express(tm) modules with AMD Embedded R-Series Accelerated Processing Unit (APU) is now available. The intelligent starter kit MSC C6-SK-A7-T6T2 contains a COM Express(tm) Type 6 baseboard, an active heat sink with fan and two DDR3 memory modules.


The intelligent starter kit MSC C6-SK-A7-T6T2 contains a COM Express™ Type 6 baseboard, an active heat sink with fan and two DDR3 memory modules. Users of the kit are free to choose one of four COM Express™ Type 6 computer modules with Embedded R-Series APU from MSC’s MSC C6C-A7 product family. Furthermore, the starter kit is also offered with a 15 inch XGA TFT display with LED backlight. Different display types or touch screen panels are available on request.


The compact baseboard with dimensions of 140 mm x 184 mm offers the module socket and numerous important connectors, above all the newly available Type 6 interfaces defined in the COM Express™ specification V2.0. The interfaces include configurable Digital Display Interfaces (DDI) which can be used via three each DisplayPort and HDMI connectors and a DVI port. In addition, four USB 3.0 ports, Ethernet, VGA, HD audio, SATA and even a PCI Express™ x4 slot also found place onboardThe COM Express™ Type 6 module platform MSC C6C-A7 from MSC integrates an Embedded R-Series APU from AMD and is characterized by very powerful graphics and high parallel computing performance with low power dissipation. Today, there are four processor variants available. For power demanding applications, the MSC C6C-A7 computer-on-modules integrate an AMD R-460L 2.0 GHz (2.8 GHz Turbo) or AMD R-452L 1.6 GHz (2.4 GHz Turbo) quad-core processors. The thermal design power (TDP) levels are 25 W and 19 W, respectively. The two dual-core versions are populated with the AMD R-260H 2.1 GHz (2.6 GHz Turbo) processor or the AMD R-252F 1.7 GHz (2.3 GHz Turbo) processor – each featuring 17 W TDP. The processors support the AMD64 technology and the AMD-V™ virtualizatiotechnology..................




refer to:http://smallformfactors.com/news/msc-kit-com-expresstm-type-modules/#at_pco=cfd-1.0

Brand New Rackmount 1U Networking Appliance System with 3rd generation Intel Core i processor

ANR-IB751N1/A/B networking appliances.


ANR-IB75N1/A/B is a rackmount platform (440x372x44mm) which can be installed in the 19” rack. It can carry a 3rd generation Intel Core i i3, i5, i7, or Pentium processors to deliver higher efficiency, increased processing throughput, and improved performance on applications. ANR-IB75N1/A/B also comes equipped with a maximum 16GB DDR3 memory and optional 2 or 4 x SFP and 8 x LAN ports. System Integrators can select different configurations for their network appliances. It offers the best P/P ratio in applications like the UTM, IDS/IPS, VPN, Firewall, Anti-Virus, Anti-Spam, RSA gateway, QoS, streaming.
ANR-IB75N1/A/B uses 80 Plus PSU which reduces energy consumption and helps protect the environment. The software and hardware configurable LAN bypass feature also prevents communication breaks due to power loss or system hang-ups. In addition to Intel long life support chipsets, ANR-IB75N1/A/B is designed with a long-term support of 5 years.




Key features:
1. Support 3rd generation Intel Core i LGA1155 i3/i5/i7/Pentium cores processor
2. Intel B75 Chipset
3. DDRIII DIMM x 2, up to 16GB memory.
4. Intel 82576EB x 2 Fiber ports
5. Intel 82574L 10/100/1000Mbps x 8 ports
6. Two pairs LAN ports support bypass feature (LAN 1/2 + LAN 3/4)
7. LAN bypass can be controlled by BIOS and Jumper
8. CF socket, 2.5” HDD x 2, SATA III x 1, SATA II X1
9. Console, VGA (pinhead), USB 3.0 x 2 (2 x external)
10. Support boot from LAN, console redirection
11. Equipped with 80 Plus Bronze PSU to decrease CO2 dissipation and protect our environment
12. LCM module to provide user-friendly interface
13. Standard 1U rackmount size


Product information：
http://www.acrosser.com/Products/Networking-Appliance/Rackmount/ANR-IB75N1／A／B/Networking-Appliance-ANR-IB75N1／A／B.html


Ordering information：
1.ANR-IB75N1: 1U Networking Rackmount Platform with PCH B75, 8 x RJ45 GbE LAN (2 pair bypass)

2.ANR-IB75N1A: 1U Networking Rackmount Platform with PCH B75, 8 x RJ45 GbE LAN (2 pair bypass), and 2 x Fiber ports

3.ANR-IB75N1B: 1U Networking Rackmount Platform with PCH B75, 8 x RJ45 GbE LAN (2 pair bypass), and 4 x Fiber ports
Contact：
http://www.acrosser.com/inquiry.html

Remote desktops for C4ISR

Virtualization trends in commercial computing offer benefits for cost, reliability, and security, but pose a challenge for military operators who need to visualize lossless imagery in real time. 10 GbE technology enables a standard zero client solution for viewing pixel-perfect C4ISR sensor and graphics information with near zero interactive latency.

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refer to : http://mil-embedded.com/articles/10-real-time-remote-desktops-c4isr/#utm_source=Cloud%2Bmenu&utm_medium=text%2Blink&utm_campaign=articles

Gaming Platform with AMD Embedded G-Series

A new All-in-One Gaming Board, the AMB-A55EG1. AMB-A55EG1 features AMD Embedded G-Series T56N 1.65GHz dual-core APU, two DDR3-1333 SO-DIMM, which provides great computing and graphic performance is suitable for casino gaming and amusement applications. It is designed to comply with the most gaming regulations including GLI, BMM, and Comma 6A. AMB-A55EG1 is specifically designed to be a cost competitive solution for the entry-level gaming market.

AMB-A55EG1 utilizes the functions of an X86 platform, 72-pin Gaming I/O interface, intrusion detection and also various security options, and a complete line of Application Programming Interfaces to create smoother gaming development.

For more information on AMB-A55EG1 or any other products, please contact your local Acrosser sales channel or logon to our website: www.acrosser.com

Product information：
http://www.acrosser.com/Products/Gaming-Platform/All-in-One-Gaming-Board/AMB-A55EG1/AMD-Embedded-G-Series-AMB-A55EG1.html

Contact：
http://www.acrosser.com/inquiry.html

Advances in EDA design methodologies led

FPGAs have become some of the most important drivers for development of leading edge semiconductor technology. The complexity of programmable devices, and their integration of diverse high-performance functions, provides excellent vehicles for testing new processes. It’s no accident that Intel has selected Achronix and Tabula, both makers of programmable devices, as the only partners that have been granted access to their 22 nm 3D Tri-Gate (FinFET) process. In February, Intel also announced an agreement with Altera, which will enable the company to manufacture FPGAs using their next-generation 14 nm Tri-Gate process.

In parallel with driving manufacturing, FPGA technology development must also include enhancements to design tools and flows. As vendors strive to make their devices more SoC- and ASIC-like, they are also adopting standards and collaborating with EDA companies to integrate their tools more seamlessly. These collaborations are producing great benefits for designers, as FPGA design methodologies are leading the way in areas that the EDA industry has long been promising new capabilities, such as in Electronic System Level (ESL) synthesis, IP integration and re-use, and higher-level tools for software/hardware co-design.

FPGA design methodologies have long integrated EDA point tools, such as simulation and PCB design, into FPGA vendor’s design platforms. Now, vendors such as Synopsys, with their Synplicity tools, and Xilinx with Vivado, are collaborating to build more complete integrated top-to-bottom flows. To address the greater complexity of FPGAs that may now contain up to two million equivalent logic cells, Synopsys has added Hierarchical Project Management (HPM) to Synplicity. HPM supports distributed design teams and parallel development, enabling partitioning of RTL and sharing of design debug tasks. Xilinx has adopted the industry-standard Synopsys Design Constraint (SDC) timing constraints (to replace Xilinx proprietary UDC) in a design flow that can be driven from standard Verilog HDL.

1.EASING IP INTEGRATION

2.INDUSTRY STANDARDS ENABLE HIGHER LEVELS OF ABSTRACTION

3.THE FUTURE OF FPGAS

 

...

refer to :
http://dsp-fpga.com/articles/advances-in-eda-design-methodologies-led-by-next-generation-fpgas/

Latest configurable Analog Front End (AFE) simplifies interfacing to hundreds of sensors

Many of today's embedded systems incorporate multiple analog sensors that make devices more intelligent, and provide users with an array of information resulting in improved efficiency or added convenience. The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU, is often an assumed "burden" in designing sensor interface circuits. However, the latest concept in a configurable AFE, integrated into a single package, is helping systems designers overcome sensor integration challenges associated with tuning and sensor drift, thereby reducing time to market. The following discussion examines how the versatility of such a technology allows the designer to tune and debug AFE characteristics on the fly, automate trimming and adjust for sensor drift, and add scalability to support multiple sensor types with a single platform.

The ubiquitous use of sensors in our smart devices – from cell phones to industrial equipment and even medical devices – has increased the need for more intelligent sensor technologies that are more versatile, lower overall costs, and require fewer resources to develop and maintain.

Most analog sensor systems comprise three key elements: the analog sensor that measures a specific form of energy, the micro controller (MCU) that processes the digital equivalent of the sensor’s signal, and between them is the Analog Front End (AFE) system (Figure 1). The AFE receives the sensor’s signal and converts/transforms it for the MCU to use, as in most cases the sensor output signals cannot be directly interfaced to an MCU.

Figure 1: The Analog Front End (AFE) converts and conditions analog sensor signals for use by the MCU.

The challenge associated with current AFE design approaches is the time-consuming trial-and-error tuning process, and the lack of flexibility and scalability to support multiple sensors from a single AFE. Moreover, many AFEs do not account for sensor drift or adjust for sensor trimming during production, which directly reduces the quality of the sensor. However, new fully configurable AFE technology is enabling designers to overcome these hurdles.

The importance of the AFE

The AFE itself performs multiple functions, depending on the application. One function of the AFE is to amplify signals that are too weak for the MCU to read. The AFE circuitry employs amplifiers to provide output voltages that are hundreds or up to thousands of times larger than the voltage provided by the sensor. This is typically done with op-amps that can vary widely in cost and power based on the required characteristics. Depending on the sensor characteristics, the AFE amplifier structure will vary. For example, if the sensor output is differential and low impedance, a simple differential input can be used. If, on the other hand, the sensor output is differential and high impedance, a more complicated instrumentation amplifier, with matching high-impedance inputs, may be needed.

Another function of the AFE is to filter unwanted frequency ranges from the sensor, for example, to satisfy the Nyquist limit or to remove a DC offset. This noise must be removed before the analog signal is converted to digital. The AFE must employ low-pass filter circuitry to block out high-frequency noise and/or employ high-pass circuits to remove lower-frequency noise.

A third function of the AFE is to convert signals from one signal type to another. For example, typical sensors output a voltage, but some output a current. The MCU ADC circuits do not accept current inputs, so such currents have to be converted to voltages before going to the MCU. This current-to-voltage conversion is performed by the AFE circuit, called a transimpedance (I/V) circuit, which also amplifies the resulting voltage to levels usable by the MCU.

Challenges to AFE designs

Most AFE circuits are custom designed to meet the electrical requirements of a particular system under development. Engineers must design the circuitry, select the appropriate ICs and passive components, then test and tune the resulting circuit and PCB layout. In many cases, this takes a trial-and-error method to calibrate the right analog circuit design. This iterative tuning process is time and resource consuming, adversely affecting development cost and time-to-market. In addition, the AFE is often difficult to simulate and must be adjusted because of specific component behavior, board layout, and nearby noise sources.

There is also limited or no scalability of the AFE circuitry to support multiple sensors, let alone multiple types of sensors (that is, different topologies). The AFE circuit is designed for one particular sensor, making it difficult to swap one sensor for another using the same AFE – even if they employ the same topology.

Finally, sensors need constant tuning either during production – adjusted for sensor trimming – or because they degrade over time and cannot easily be corrected after they are deployed in the field. Fixed-component AFE designs do not correct for sensor drift nor are they easily adjusted for sensor trimming. A software-supported design approach can help.

Let’s examine each of these challenges.

Configurable AFE eases calibration trial and error

Looking at the hundreds of different types of sensors available, one can observe common topologies and signal characteristic ranges and understand that having the ability to simply change the characteristics of the op-amps, or to dynamically change the gain values, will significantly reduce the complexity and reduce development time.

The Renesas Smart Analog technology is an example of a fully configurable AFE technology that allows for such capability. As Figure 2 shows, such technology includes five elements: three separate configurable amplifiers, an additional amplifier with sync detection capability, a general-purpose op-amp, a low-pass filter with variable cutoff frequency, and lastly, a high-pass filter with variable cutoff frequency.

Figure 2: Diagram of a fully configurable AFE with an optional integrated MCU

The design engineer can create the desired custom AFE circuitry by simply setting the main parameters for these various circuit blocks, and then selecting the connections between these blocks. Three highly configurable amplifiers can be used to produce a tailored I/V transimpedance converter/amplifier, a noninverting amplifier, an inverting amplifier, a differential amplifier, or a summing amplifier. The chip can be custom configured to implement a range of signal amplification gains, and it provides an adjustable span of signal voltage offsets.

Additionally, the amplifiers in this IC can be configured to implement a single-channel, high-impedance instrumentation amplifier. This type of differential amplifier is essential for interfacing to high-impedance sensors such as piezoelectric types.

As the AFE takes care of amplifying/filtering/converting the signals from the sensor, the MCU (internal or external device) can analyze the AFE signals to dynamically change the gain values (that is, while the system is operating) to compensate for changes in ambient environment. This “closed loop,” self-adjusting AFE structure provides a more robust, intelligent sensor interface.

An integrated AFE+MCU device offers the additional benefit of automating the trimming process as it will read the signals from the AFE and compare that to the known parameters to make the necessary adjustments on the AFE, thereby cutting system production costs. In the same way, the MCU can automatically adjust the AFE gain to counteract the signal-generation deviations expected to occur over time as the sensor degrades.

Configurable AFE provides scalability

While configurability is important to reduce complexity and debugging time, another key design factor is scalability. An AFE with enough connection terminals to accommodate all the sensors typically needed eliminates the traditional requirement to have a separate AFE circuit for each sensor. Handling the entire array of sensors via one AFE helps shrink the circuit board and simultaneously decreases system component counts while reducing power consumption by as much as 20 percent. In fact, because of the simple interface of these AFEs – to just an SPI line and the ADC channels from the MCU – it is possible to connect to as many as 96 sensors using one MCU.

A software-supported design approach

Extreme configurability can come with the burden of tool complexity, so it is important to have a simple software-based design tool that can configure and customize the characteristics of the AFE for that specific application. Designers no longer need to understand the lowest level of the hardware, nor be analog experts when the AFE register values can be simply set, and the topology, gain/offset values, and characteristics can all be done in software.

Such a tool should run on a PC and provide an easy way for selecting typical sensor types, such as pressure, humidity, acceleration, impact, magnetic, and piezoelectric types – supporting multiple topologies and characteristics. The Smart Analog software provides this highly intuitive environment where designers easily set parameters, change topologies, do offset tuning, and have the ability to add filters and, of course, have access to the signal pins.

Because the tool itself already has libraries of different sensor profiles, it is easy for a systems engineer to have a starting point in their design. A graphical representation of the output signals from the AFE can be used to monitor systems with close-to-real-time feedback, which will make it very easy to make the AFE adjustments and tuning. All these features reduce complexity in development and thus reduce resource costs.

Once the configuration is set, the tool outputs a register file that can be used by the software on the MCU. The MCU stores the sensor settings in on-chip flash (nonvolatile) memory within its firmware, and when power is applied to the system, the MCU sends the stored settings to registers in the Smart Analog IC, reconfiguring that chip accordingly.

Simplifying the burden of AFE designs

The AFE is a critical, yet sometimes underappreciated component to a sensor system. The typical discrete approach of adding op-amps and filters, and trial-and-error soldering of resistors is not efficient and the cost of time in debugging and development easily outweighs the cost of adding an intelligent, MCU-based configurable AFE. But not all configurable AFEs are built the same. So, it is important to consider the flexibility and scalability of the AFE to support different types of sensors, and the intelligence to adjust “on the fly” or in the field. Simple, easy-to-use software tools can ease this process and can be used by even the non-analog experts on the team.

refer to : http://embedded-computing.com/articles/latest-afe-simplifies-interfacing-hundreds-sensors/#at_pco=cfd-1.0